1.5mm-HDI-PCB-8-Layer-with-TU-883

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1.5mm-HDI-PCB-8-Layer-with-TU-883: Ultra-Low-Loss, High-Speed-Performance-for-RF-and-Wireless-Applications

Shipped: 4th-FEB-2025

1. TU-883 Introduction

Engineered with a high-performance resin system and reinforced with regular woven E-glass, TU-883 delivers an ultra-low dielectric constant and dissipation factor, making it the ideal choice for high-speed, low-loss designs in radio frequency and wireless applications.

This advanced material is fully compatible with lead-free environmental processes and FR-4 manufacturing methods, ensuring seamless integration into your production line. ThunderClad 2 laminates also boast excellent moisture resistance, improved CTE, superior chemical resistance, outstanding thermal stability, and enhanced CAF resistance, providing unmatched reliability in the most demanding environments.

Choose TU-883 for cutting-edge performance, durability, and efficiency in next-generation PCB designs.

2. Key Features of (TU-883):

- High Tg (TMA) of 170°C

- Dielectric constant is 3.39 @ 10GHz

- Dissipation factor is 0.0045 @10GHz

- Stable and flat Dk/Df performance over frequency and temperature

- Compatible with modified FR-4 processes

- Excellent moisture resistance and Lead Free reflow process compatible

- Improved z-axis thermal expansion

- Anti-CAF capability

- Excellent through-hole and soldering reliability

- Halogen Free

3. PCB Stackup: 8-layer rigid PCB (Component side at top)

4. Basic PCB Specifications:

Board type: 8 layers

Material type: TU883

Solder mask: Both sides, Blue

Silkscreen print: Top side, white

Surface finish: ENEPIG

Total board thickness: 1.45mm +/- 10%

Board size: 97.3mm x 67.7mm=1 PCS

Minimum hole size: 0.25mm

Solder mask thickness: 10um

Minimum dielectric thickness: 100um

Minimum trace line width: 150um

Minimum spacing: 160um

Blind via: yes, L1-L2, L7-L8

Buried via: yes, L2-L7

Back drilled via: yes, L1-L6

Impedance controlled:

100 ohm, differential pairs, Top layer, 4mil / 5 mil trace/gap, reference layer 2

90 ohm, differential paris, bot layer, 4mil / 7 mil trace/gap, reference layer 7

50 ohm, differential paris, layer_6 signal, 5mil / 6mil trace/gap, reference layer 5,7

Counterholes are applied on top layer, 90 degree, 0.5mm deep.

Edge plating is applied on designated area.

5. PCB Statistics:

Components: 49

Total Pads: 98

Thru Hole Pads: 46

Top SMT Pads: 38

Bottom SMT Pads: 14

Vias: 63

Nets: 6

6. Type of artwork supplied: Gerber RS-274-X

7. Quality standard: IPC-Class-2

8. Availability: worldwide

9. Some Typical Applications:
- Radio frequency

- Backplane, High performance computing

- Line cards, Storage

- Servers, Telecom, Base station

- Office Routers

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